Heat sink extruded aluminum profile

professionelle Computing-Lösungen
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  • High power density with Intel® Core™ i CPUs of the 9th generation
  • Passive cooling and 24/7 operation
  • Flexible I/O board
  • Customizability
  • On request available as in-vehicle system
Preis auf Anfrage
  • High-Performance with Intel® Core™ i CPUs 12th/13th/14th Generation
  • Incl. Wi-Fi/Bluetooth, GNSS/LTE
  • Two 2.5" shuttles with hot-swap function
  • Passive cooling for flexible and quiet use
  • Resistant to shocks and vibrations
  • USB-C & 3x 2.5 GBit LAN for fast data transfer
Preis auf Anfrage